Built to Be Embedded
HOTMesh™ is designed for integration into OEM products, not for standalone deployment.
A HOTNode™ is the HOTMesh™ daughter board form factor:
A compact embedded module that gives your product access to the full HOTMesh™ wireless infrastructure layer.
What OEM Engineers Need to Know
HOTMesh™ integration is a real engineering engagement. Below are the most common questions from OEM engineering teams evaluating HOTNode™ for product integration.
HOTNode™ is the HOTMesh™ daughter board form factor: a compact embedded module designed for direct integration into OEM hardware. The module includes an integrated internal antenna with external antenna connector options for applications requiring extended range or specific RF configurations. Integration involves hardware interface design, firmware integration, network commissioning, and field service process adaptation. It is not a plug-in module with zero redesign requirement.
Recent testing has shown ranges out to over 1400' line of sight outdoors and between 3 floors of reinforced concrete indoors using the on-board antenna. When connected to an external antenna, we've documented communication out to nearly 1 mile with the units sitting on the ground.
Supported interfaces include I2C, BLE, Zigbee, Matter, and Thread. Additional interface support is available through direct consultation with 78Dragons engineering based on your specific product architecture requirements.
OEMs integrating HOTNode™ should plan for hardware interface design, firmware integration with the HOTMesh™ SDK, network commissioning and configuration, and adaptation of field service processes to the wireless architecture. 78Dragons provides direct engineer-to-engineer support from prototype through production, including SDK access, reference code, and technical documentation appropriate to each integration stage.
A HOTMesh™ developer kit is available for qualified OEM evaluation programs. The kit includes the HOTNode™ module and integration documentation relevant to your target application. Developer kit requests go through a brief technical qualification to ensure the evaluation is matched to a relevant integration scenario. Request via the contact page.
HOTMesh™ supports over-the-air firmware updates across all nodes in the network. OEM products built on HOTMesh™ can update device firmware in the field without physical access to individual devices. This is a material operational advantage in distributed installations where physical access to deployed nodes is expensive, impractical, or hazardous. The mechanics of this process vary system to system, our engineering team will aid OEMs in the design and implementation of this functionality.
HOTMesh™ provides device supervision and network health visibility across all connected nodes. OEM products built on HOTMesh™ can expose device status, network connectivity, and operational conditions to service teams or end-user management interfaces. This represents a significant operational improvement over passive wired sensor architectures with no health visibility.
Start the Integration Conversation
If you are evaluating HOTMesh™ for OEM integration, the right starting point is a technical briefing, not a licensing or procurement conversation. Understand the architecture fit first.
Request a Developer Kit or Technical Briefing
Engineer-to-engineer. Bring your product architecture and target deployment. We will tell you what integration involves and whether HOTMesh™ is the right fit.